About Power Adhesives TEC Bond 213
The TEC Bond 213 is a general purpose economy glue stick with a long open time and the ability to bond to a wide variety of surfaces including wood, ceramics, polystyrene and PVC. For a low cost general purpose hot melt, the TEC Bond 213 is a very good option.
Additional Information
- Color: Clear
- Suggested Application Temp: 380ºF
- Brookfield Viscosity: 600cps @350ºF
- Softening Point: 195ºF
- Heat Resistance: 165ºF
- Open Time: Long
- Low Temperature Flexibility: 5ºF
TEC Bond 213 Sticks per Case Breakdown
- 1/2″ x 12″ 11 LB Box = Approx 176 Glue Sticks
- 5/8″ x 12″ 11 LB Box = Approx 99 Glue Sticks
- 1 3/4″ x 1 3/4″ 22 LB Box = Approx 176 Glue Sticks
Power Adhesives TEC Bond 213 Specifications
Form |
½” x 12” |
⅝” x 12” |
1¾” x 1¾” |
Sticks per lb (approx) |
16 |
9 |
8 |
Carton quantity |
11lb |
11lb |
22lb |
Pallet weight: |
1100lb |
1100lb |
1100lb |
Suggested application temperature |
380ºF |
380ºF |
380ºF |
Brookfield viscosity (POW-12-VISC) spindle 27 |
6000cps @ 350ºF |
6000cps @ 350ºF |
5500cps @ 350ºF |
Ring & ball softening point (ASTM E28) |
195ºF |
195ºF |
190ºF |
Heat resistance (BS5350 Part H3) |
165ºF |
165ºF |
165ºF |
Open time |
Long |
Long |
Long |
Low temperature flexibility (tg) |
5ºF |
5ºF |
5ºF |
Power Adhesives TEC Bond 213 Data Sheets
TEC Bond 213 Technical Data Sheet (TDS)
- Technical Data Sheet (TDS)
TEC Bond 213 Safety Data Sheet SDS
- Safety Data Sheet (SDS)