About Power Adhesives TEC Bond 214
The TEC Bond 214 is a good economy packaging glue stick for carton sealing and case closing. The 214 has a short open time and gives a fast bond under compression. This hot melt comes in a variety of glue stick sizes to fit many types of glue guns.
Power Adhesives TEC Bond 214 Specs
Form |
½” x 12” |
½” x 12” |
1¾” x 1¾” |
Pastilles |
Sticks per lb (approx) |
16 |
9 |
8 |
|
Carton quantity |
11lb |
11lb |
22lb |
44lb sack |
Pallet weight: |
1100lb |
1100lb |
1100lb |
2200lb |
Suggested application temperature |
320ºF-380ºF |
320ºF-380ºF |
320ºF-380ºF |
320ºF-380ºF |
Brookfield viscosity (POW-12-VISC) spindle 27 |
2000cps @ 350ºF |
2000cps @ 350ºF |
2000cps @ 350ºF |
2000cps @ 350ºF |
Ring & ball softening point (ASTM E28) |
235ºF |
235ºF |
235ºF |
235ºF |
Heat resistance (BS5350 Part H3) |
185ºF |
185ºF |
185ºF |
185ºF |
Open time |
Short |
Short |
Short |
Short |
Low temperature flexibility (tg) |
14ºF |
14ºF |
14ºF |
14ºF |
TEC Bond 214 Data Sheets
TEC Bond 214 Technical Data Sheet (TDS)